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Digital Testing g g Lecture 5: Fault Modeling Instructor: Shaahin - - PowerPoint PPT Presentation

Digital Testing g g Lecture 5: Fault Modeling Instructor: Shaahin Hessabi Department of Computer Engineering Department of Computer Engineering Sharif University of Technology Adapted with modification from lecture notes prepared by the


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Digital Testing g g

Lecture 5: Fault Modeling

Instructor: Shaahin Hessabi Department of Computer Engineering Department of Computer Engineering Sharif University of Technology Adapted with modification from lecture notes prepared by the Adapted, with modification, from lecture notes prepared by the book authors

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SLIDE 2

Outline

The testing problem Wh

d l f l ?

Why model faults? Some real defects in VLSI and PCB

C f l d l

Common fault models Stuck-at faults

Si l k f l

Single stuck-at faults Fault equivalence Fault dominance and checkpoint theorem Fault dominance and checkpoint theorem Classes of stuck-at faults and multiple faults

Transistor faults Summary

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Testability: Lecture 5

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The Testing Problem

Costs increase dramatically as faulty components find their

way into higher levels of integration (rule-of-10) way into higher levels of integration (rule of 10).

Test: Apply a set of vectors to each device off the

manufacturing line and compare outputs to the known good g p p g response.

The optimum test set will detect the greatest number of

p g defects that can be present in a device with the least number

  • f test vectors (high defect coverage).

Types of test sets:

Exhaustive: apply every possible input vector.

F i l f i f h d i

Functional: test every function of the device. Fault-Model Derived: find a test for every “modeled” fault.

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Testability: Lecture 5

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Testing

Which type is closest to optimum Which type is closest to optimum Consider a 74181 ALU chip- 14 inputs p p

Exhaustive testing

Will detect 100% of detectable faults

i

14

Requires 214 = 16,384 test vectors A 16 bit ALU with 38 inputs would take 7.64 hours to exhaustively test at

10 MHz

Functional testing

Will detect 100% of detectable faults

T t l f ti l t ti ill t k 448 t

Total functional testing will take over 448 vectors

Each logical mode can be tested with about 8 vectors Each arithmetic mode can be tested with about 20 vectors

There is no algorithmic way to verify that all functional modes have been

tested (designer expertise required)

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SLIDE 5

Which type is closest to optimum (cont’d) yp p ( )

Modeled fault testing (e.g. single stuck faults)

Will detect 100% of detectable modeled faults Requires only 47 vectors Vectors can be generated and analyzed (for fault coverage) using Vectors can be generated and analyzed (for fault coverage) using

computer programs

The number of defects actually detected by this test vector set depends on

the quality of the fault model

The key is to select a fault model that can be applied to the appropriate

level of circuit abstraction (logic level) and that maps to the most possible level of circuit abstraction (logic level) and that maps to the most possible physical defects

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Why Model Faults? y

I/O function tests inadequate for manufacturing

(functionality versus component and interconnect testing) R l d f ( f h i l) d f

Real defects (often mechanical) too numerous and often

not analyzable

A fa lt model identifies targets for testing A fault model identifies targets for testing A fault model makes analysis possible Eff

ti bl b i t

Effectiveness measurable by experiments

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SLIDE 7

Some Real Defects in Chips

Processing defects

  • Missing contact windows
  • Parasitic transistors
  • Oxide breakdown
  • . . .

Material defects

B lk d f t ( k t l i f ti )

  • Bulk defects (cracks, crystal imperfections)
  • Surface impurities (ion migration)
  • . . .

Time dependent failures Time-dependent failures

  • Dielectric breakdown
  • Electromigration
  • . . .

Packaging failures

  • Contact degradation
  • Seal leaks
  • . . .

Ref.: M. J. Howes and D. V. Morgan, Reliability and Degradation - S i d t D i d Ci it Wil 1981

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Semiconductor Devices and Circuits, Wiley, 1981.

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SLIDE 8

Observed PCB Defects

Defect classes Occurrence frequency (%) Defect classes Shorts Occurrence frequency (%) 51 Shorts Opens Missing components 1 6 Wrong components Reversed components Bent leads 13 6 8 Bent leads Analog specifications Digital logic 8 5 5 g g Performance (timing) 5

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Ref.: J. Bateson, In-Circuit Testing, Van Nostrand Reinhold, 1985.

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Common Fault Models

Single stuck-at faults

T i d h f l

Transistor open and short faults Memory faults PLA faults (stuck-at, cross-point, bridging) Functional faults (processors) Delay faults (transition, path) Analog faults Bridging faults …

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SLIDE 10

Single Stuck Faults g

Structural logic-level fault model g Assumptions

1.

Only one line is faulty y y

2.

Faulty line permanently set to 0 or 1

  • Fault can be at an input or output of a gate
  • 3. The function of the gates in the circuit is not affected by

the fault

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Single Stuck-at Fault

Referred to as the classical fault model Most widely studied and used

y

It represents many different physical faults It is independent of technology Experience has shown that tests that detect SSFs detect many non-

classical faults as well

The number of SSFs in a circuit is small. The number of SSFs in a circuit is small.

– Moreover, the number of faults to be explicitly analyzed can be reduced by fault collapsing techniques.

If h li hi h SSF b d fi d h b f ibl

If there are n lines on which SSFs can be defined, the number of possible

faults is 2n. – We need to consider every fanout branch as a separate line

y p – The total number of SSFs ~ 2Gf G : # of gates f : the average fan out count

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f : the average fan-out count

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SLIDE 12

Single Stuck-at Fault g

Example: XOR circuit has 12 fault sites ( ) and 24 single stuck-at faults

c j Good circuit value Faulty circuit value a c d

1

g h

s-a-0

j z

0(1) 1(0)

b e f i

1

k z

1

f Test vector for h s-a-0 fault

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SLIDE 13

Multiple Stuck-at Faults p

Important in high density circuits A multiple stuck-at fault means that any set of lines is

stuck-at some combination of (0,1) values.

The total number of single and multiple stuck-at faults in

a circuit with k single fault sites is 3k-1.

A single fault test can fail to detect the target fault if

another fault is also present, however, such masking of

  • ne fa lt b another is rare
  • ne fault by another is rare.

Statistically, single fault tests cover a very large number of

multiple faults multiple faults.

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SLIDE 14

Pin Faults

Stuck fault on I/O connection of a module Exclusive-OR gate:

6 pin faults:

a/0 a/1 b/0 b/1 Z/0 Z/1 a/0, a/1, b/0. b/1, Z/0, Z/1

100% pin fault coverage:

{ab= 00, 01, 10} or {ab= 01, 10, 11} or {ab= 00, 01, 11} or {ab= 00, 10, 11}

100% flattened fault coverage:

Requires all 4 vectors Requires all 4 vectors

a c d z a b d e

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f

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SLIDE 15

Fault Equivalence

Number of fault sites in a Boolean gate circuit

= #PI + #gates + # (fanout branches). #PI #gates # (fanout branches).

Fault equivalence: Two faults f1 and f2 are equivalent if all

tests that detect f1 also detect f2, and vice-versa. ,

If faults f1 and f2 are equivalent then the corresponding faulty functions

are identical (functional equivalent).

Fault collapsing: All single faults of a logic circuit can be

divided into disjoint equivalence subsets, where all faults in a subset are mutually equivalent A collapsed fault set contains subset are mutually equivalent. A collapsed fault set contains

  • ne fault from each equivalence subset.

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Equivalence Rules q

sa0 sa0 sa0 sa1 sa0 sa1 sa0 sa1 sa0 sa1 sa1 sa1 AND OR WIRE sa0 sa1 sa0 sa1 1 AND OR sa0 sa0 sa1 sa1 NOT sa0 sa1 sa0 sa1 sa0 sa1 sa0 sa1 NAND NOR sa0 sa0 sa1 sa0 sa1 sa0 sa1 sa0 sa0 sa1 sa1 FANOUT

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Equivalence Example q p

sa0 sa1 sa0 sa1 sa0 sa1 Faults in red removed by equivalence ll i sa0 sa1 sa0 sa1 sa0 sa1 sa0 sa1 collapsing sa0 sa1 sa0 sa1 sa0 sa1 sa0 sa1 sa0 sa1 sa0 sa1 sa0 sa1 sa0 sa1

collapsed faults

sa0 sa1 sa0 sa1 20 Collapse ratio = = 0 625

collapsed faults Sharif University of Technology

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Collapse ratio = ----- = 0.625 32

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SLIDE 18

Fault Dominance

If all tests of some fault F1 detect another fault F2, then F2 is

said to dominate F1 said to dominate F1.

Dominance fault collapsing: If fault F2 dominates F1, then F2

is removed from the fault list is removed from the fault list.

When dominance fault collapsing is used, it is sufficient to

consider only the input faults of Boolean gates. See the next consider only the input faults of Boolean gates. See the next example.

In a tree circuit (without fan-outs) PI faults form a

( ) dominance collapsed fault set.

If two faults dominate each other then they are equivalent.

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SLIDE 19

Dominance Example p

All tests for F2 s-a-1 F1 F2 001 All tests for F2 s-a-1 110 010 000 101 011 100 Only test for F1 s a 1 Only test for F1 s-a-1 s-a-1 1 s-a-1 s-a-0 A dominance collapsed fault set

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A dominance collapsed fault set

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Checkpoints p

Primary inputs and fan-out branches of a combinational

i it ll d checkpoints circuit are called checkpoints.

Checkpoint theorem: A test set that detects all single

(multiple) stuck at faults on all checkpoints of a (multiple) stuck-at faults on all checkpoints of a combinational circuit, also detects all single (multiple) stuck-at faults in that circuit.

Total fault sites = 16 Total fault sites = 16 Checkpoints ( ) = 10

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Classes of Stuck-at Faults

Following classes of single stuck-at faults are identified by

fault simulators: fault simulators:

Potentially-detectable fault -- Test produces an unknown (X) state at

primary output (PO) of a sequential circuit; detection is probabilistic, ll i h 50% b bili usually with 50% probability.

Initialization fault -- Fault prevents initialization of the faulty circuit; can

be detected as a potentially-detectable fault. p y

Hyperactive fault -- Fault induces much internal signal activity without

reaching PO. R d d f l N i f h f l

Redundant fault -- No test exists for the fault. Untestable fault -- Test generator is unable to find a test.

Superset of redundant faults in sequential circuits. Similar to redundant faults in combinational circuits.

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Untestable Faults

Unexpected redundancy

X3/1, X1/0, X2/0: untestable

Either M or N always 0 X3 always 1 Output can be taken from G instead of F

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SLIDE 23

Untestable Faults (cont’d) ( )

Internal signal dependencies g p

Cannot set 1 on both inputs to the OR gate Untestable fault

OR changed to XOR

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SLIDE 24

Untestable Faults (cont’d) ( )

Hazard elimination redundancy

Problem: output changes when A changes while BC = 11 Solution: intentional redundant implication BC

U t

t bl f lt /0

Untestable fault: e/0

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Untestable Faults (cont’d) ( )

Error detection redundancy

Fault-free decoder

Only one output =1

E

E = 0

E/0 untestable if no fault in

decoder decoder

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Untestable Faults (cont’d) ( )

Redundant transistors and gates

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Untestable Faults (cont’d) ( )

C/1 untestable

Z AB + ABC AB

Z = AB + ABC = AB

Testable fault A1/0 (ABC = 110)

Untestable in presence of the untestable fault C/1

p

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SLIDE 28

Bridging Fault Model g g

  • Assumptions:

T d f i it h t d t th

  • Two nodes of a circuit are shorted together
  • Usually assumed to be a low resistance path (hard short)
  • Three classes are typically considered:
  • Three classes are typically considered:

1.

Bridging within a logic element (transistor gates, sources, or drains shorted together)

2.

Bridging between logic nodes (i.e., inputs or outputs of logic elements) without feedback

  • Logical fault model

g

3.

Bridging between logic nodes with feedback

  • May cause oscillation or latch

i ll id d i b id i f l i l d b

  • Typically not considered is bridging of non-logical nodes between

logic elements (transistor shorts across logic elements)

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Bridging Fault Model (Cont’d) g g

( )

  • Advantages:

C l t f h i l d f t h i di t

  • Covers a large percentage of physical defects; some research indicates

that BFs account for up to 30% of all defects

  • Disadvantages:
  • sadvantages:
  • ATPG algorithms are more complex, since testing requires setting the

two bridged nodes to opposite values and observing the effect

  • Requires a lower level circuit description for BFs within logic elements

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Delay Fault Model y

  • Assumptions:

Th l i f ti f th CUT i f

  • The logic function of the CUT is error-free
  • Some physical defect, such as process variations, etc., makes some

delays in the CUT greater than some defined bounds y g

  • Two delay fault models are typically used:

1.

Gate delay, or transitional fault model

2.

Path delay fault model

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SLIDE 31

Transitional Delay Fault Model y

  • A logical model for a defect that delays either a rising or

falling transition on a specific line in the circuit falling transition on a specific line in the circuit

  • Advantage:
  • If a delay fault is large enough it behaves as a temporary stuck at
  • If a delay fault is large enough, it behaves as a temporary stuck-at-

fault, and SSF testing techniques can be applied.

  • Disadvantage:

g

  • Two patterns are required for detection: initialization and transition

detection (propagation)

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SLIDE 32

Path Delay Fault Model y

  • A fault model in which the total delays in a path from

inputs to outputs in a circuit exceeds some maximum value inputs to outputs in a circuit exceeds some maximum value

  • Advantages:
  • Detects more delay faults; i e in transitional fault model the delays of
  • Detects more delay faults; i.e., in transitional fault model, the delays of

a faulty gate may be compensated for by other faster gates in the path

  • Can be used with more aggressive statistical design philosophy
  • Disadvantages:
  • Large number of possible paths in circuit (exponential with # of gates)
  • Algorithms for test generation are more complex and less well

developed

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SLIDE 33

Transistor (Switch) Faults Transistor (Switch) Faults

MOS transistor is considered an ideal switch and two types

  • f faults are modeled:

Stuck-open: a single transistor is permanently stuck in the open state. Stuck-short: a single transistor is permanently shorted irrespective of its

gate voltage.

Detection of a stuck-open fault requires two vectors Detection of a stuck open fault requires two vectors. Detection of a stuck-short fault requires the measurement

  • f quiescent current (IDDQ).

q ( DDQ)

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SLIDE 34

Stuck Open Example Stuck-Open Example

Vector 1: test for A s-a-0 (I iti li ti t )

V

pMOS (Initialization vector) Vector 2 (test for A s-a-1) Two-vector s-open test can be constructed by

  • rdering two SSF tests

A VDD

DD

pMOS FETs 1 g

A B

Stuck-

  • pen

1

B C

1(Z) nMOS FET Good circuit states F lt i it t t

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FETs Faulty circuit states

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SLIDE 35

Stuck- open (cont’d)

Advantages

C h i l d f d b k f l d l

Covers physical defects not covered by stuck-at fault model Can be tested with sequences of stuck-at fault test

Disadvantages Disadvantages

Requires a large number of tests (sequence for each fault) Algorithms for ATPG and fault simulation are more complex and less

g p well developed

Requires a lower level circuit description (transistor level), at least for

development of the fault list development of the fault list

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SLIDE 36

Stuck Short Example Stuck-Short Example

V

pMOS Test vector for A s-a-0

A VDD

DD

pMOS FETs St k 1 IDDQ path in faulty circuit

A B

Stuck- short 1 G d i it t t

B C

0 (X) Good circuit state nMOS FET Faulty circuit state

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FETs Faulty circuit state

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Summary

Fault models are analyzable approximations of defects and are

essential for a test methodology.

For digital logic, single stuck-at fault model offers best

advantage of tools and experience.

Many other faults (bridging stuck open and multiple stuck Many other faults (bridging, stuck-open and multiple stuck-

at) are largely covered by stuck-at fault tests.

Stuck-short and delay faults are technology-dependent faults

y gy p and require special tests.

Memory and analog circuits need other specialized fault

d l d models and tests.

Current practice

Single stuck at faults Single stuck-at faults Some simple gate delay faults Pattern-sensitive faults (memory only)

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