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Pushing Performance HARTING AG Mitronics 3D-MID Reliability and Profitability Nouhad Bachnak with Control of Manufacturing Process g 3D MID Technology Technology People | Power | Partnership 2010-09-29 S. / 1 23 Outline Pushing


  1. Pushing Performance HARTING AG Mitronics 3D-MID Reliability and Profitability Nouhad Bachnak with Control of Manufacturing Process g 3D MID Technology Technology People | Power | Partnership 2010-09-29 S. / 1 23

  2. Outline Pushing Performance � HARTING Group HARTING AG Mitronics � The 3D-MID Technology � Barriers for the MID Technology Barriers for the MID Technology � Historical View Nouhad Bachnak � Manufacturing Processes � MID Process Optimisation 3D MID Technology Technology � MID Process Automation � Conclusion People | Power | Partnership 2010-09-29 S. / 2 23

  3. HARTING Group – Production Facilities Pushing Performance DE/Espelkamp 3 DE/Espelkamp 2 p p DE/Espelkamp 4 p p HARTING AG Mitronics DE/Espel- DE/Espel- kamp 5 kamp 5 kamp 1 kamp 1 Nouhad Bachnak 3D MID RO/Sibiu GB/Northampton p Technology Technology People | Power | Partnership US/Elgin 2010-09-29 CH/Biel CN/Zhuhai Inhalt S. / 3 23

  4. HARTING Groupe – Global Business Units Pushing Performance Connectivity & Networks Connectivity & Networks Integrated Solutions Integrated Solutions HARTING AG Mitronics Connectors and Networks for power supply Design and production of customised Nouhad Bachnak and data transfer. Telecommunication, Backplanes Industry, Transportation … Mitronics Applied Technologies 3D MID Technology Technology 3D MID Technology for diverse industrial Tooling design and manufacturing applications People | Power | Partnership Automotive Systems 2010-09-29 Housing and Shop Systems Mechatronics parts for steering and security S. / 4 23 applications

  5. Pushing Performance HARTING AG Mitronics Nouhad Bachnak The 3D MID Technology The 3D-MID-Technology 3D MID Technology Technology People | Power | Partnership 2010-09-29 S. / 5 23

  6. Barriers for the MID Technology Pushing Performance Extract from the appraised questionnaire of the 8. International Congress MID 2008 HARTING AG Mitronics Nouhad Bachnak 3D MID Technology Technology People | Power | Partnership Low Profitability 2010-09-29 Low Reliability S. / 6 23

  7. Historical View Pushing Performance � First research works on MID-Technology at the beginning of the 80´s gy g g HARTING AG � At this time the MID technology was not able to become accepted . Mitronics Reasons: absence of qualified materials, manufacturing processes and MID specific kno specific know how ho � Revival from 1996 Nouhad Bachnak � 1996: first high volume production of 2S product (2 shot moulding ) g p p ( g ) � 1997: development of the LDS process (Laser Direct Structuring) 3D MID � 1997-2004: development of new materials for the LDS process p p Technology Technology � 2002: high volume production of MID Antennas (2S) � 2005: serial production of LDS products � 2005: serial production of LDS products People | Power | Partnership � 2008 und 2009: jump of MID products in the market 2010-09-29 S. / 7 23

  8. Historical View- Comparison with PCB Estimated MID-Turnover in Mio. € Pushing Performance 250 HARTING AG 200 Mitronics 150 Nouhad Bachnak 100 50 3D MID Technology Technology Year MID 0 1982 1984 1986 1988 1990 1992 1994 1996 1998 2000 2002 2004 2006 2008 2010 2012 2014 2016 2018 2020 Research Phase Research Phase Growth Phase Growth Phase Development Phase Development Phase People | Power | Partnership PCB sided atent- ation PCB bly es Assemb Serial-P m registra Double PCB Pa process s Dry film mashin First PCB 2010-09-29 S. / 8 23

  9. Manufacturing Process: LDS ( (Laser Direct Structuring) g) Pushing Performance Si Single shot injection mould doped l h t i j ti ld d d HARTING AG with metal-complex Mitronics Nouhad Bachnak Laser activation Cleaning 3D MID Technology Technology C Cu plating l ti Ni P Ni-P plating l ti People | Power | Partnership Au plating Au plating 2010-09-29 S. / 9 23

  10. Manufacturing Process: LDS ( (Laser Direct Strukturing) g) Pushing Performance 1s Moulding 1s-Moulding Laser Activation Laser Activation Cleaning Cleaning HARTING AG Mitronics Nouhad Bachnak 3D MID Technology Technology Metallisation Electro Optical Test Electronic Assembly People | Power | Partnership 2010-09-29 S. / 10 23

  11. Manufacturing Process: 2S 2 Shot-Moulding MID 2 Sh t M ldi MID Pushing Performance HARTING AG Composite of two plastics Mitronics 1. Component: plateable Nouhad Bachnak 2. Component: not plateable 3D MID Technology Technology Chemical activation People | Power | Partnership Metallisation (similar to LDS) ( ) 2010-09-29 S. / 11 23

  12. Manufacturing Process: 2S 2 Shot-Moulding MID 2 Sh t M ldi MID Pushing Performance 2S-Moulding 2S Moulding 1. Component 1 Component 1 + 2 Component 1. + 2. Component HARTING AG Mitronics Nouhad Bachnak 3D MID Technology Technology Metallisation Electro Optical Test Electronic Assembly People | Power | Partnership 2010-09-29 S. / 12 23

  13. Pushing Performance HARTING AG Mitronics MID Process Nouhad Bachnak Optimisation and Automation Optimisation and Automation 3D MID Technology Technology People | Power | Partnership 2010-09-29 S. / 13 23

  14. MID Process: Overview and Dependency Pushing Performance HARTING AG Mitronics Electr. Laser & Design Moulding Metallisation Cleaning Cleaning Assembly Assembly Nouhad Bachnak 3D MID Technology Technology Curing Chip Gluing Wire Bonding Glob Top Electr. Assembly Assembly People | Power | Partnership Chip Dispensing Soldering Positioning 2010-09-29 S. / 14 23

  15. MID Process: Overview and Dependency Pushing Performance HARTING AG Mitronics Electr. Laser & Design Moulding Metallisation Cleaning Cleaning Assembly Assembly Nouhad Bachnak 3D MID Technology Technology Soldering Chip Gluing Wire Bonding Glob Top Electr. Assembly Assembly People | Power | Partnership Chip Dispensing Soldering Positioning 2010-09-29 S. / 15 23

  16. MID Process: Overview and Dependency Pushing Performance High Temperature Resistance HARTING AG Mitronics Stiffness of the Covering of the Adhesives Adhesives Wire Bond Wire Bond Nouhad Bachnak Chip Gluing Wire Bonding Glob Top Soldering 3D MID Electr. Technology Technology A Assembly bl Chip Dispensing Soldering Positioning People | Power | Partnership 2010-09-29 S. / 16 23

  17. Dependency between different Processes Example: Electronic Assembly Process E l El t i A bl P Pushing Performance HARTING AG Mitronics • Metall. for Bonding Bonding • Planarity • Planarity • Rouphness of Tracks • Chip Dimensions • Moulding Flow • SMD-Pad-Dim. Nouhad Bachnak Direction • High Temperature (CTE Anisotr.) Resistance • etc. • Roughness and Porosity • CTE-Compensation • CTE Compensation • Cleanness of the Surface • Thickness of Ni 3D MID Technology Technology Electr. Laser & Design Moulding Metallisation Cleaning Assembly People | Power | Partnership 2010-09-29 S. / 17 23

  18. MID Process Optimisation Project Definition Pushing Performance Project Charter P j t Ch t HARTING AG Parameter Q-Characteristic Mitronics CTQ Prozess- Stepp Stepp Nouhad Bachnak Q-Characteristic rameter C + E ozess- 3D MID Technology Technology Pro par FMEA People | Power | Partnership DOE CTQ: Critical to Quality CTQ: Critical to Quality Design Rules Definition Process Window Definition C+E: Cause and Effects Implementation Implementation DOE: Design of Experiment 2010-09-29 S. / 18 23

  19. Output of the Optimisation Process Pushing Performance Design Rules Definition D i R l D fi iti Process Window Definition P Wi d D fi iti HARTING AG Mitronics Nouhad Bachnak 3D MID Technology Technology People | Power | Partnership 2010-09-29 S. / 19 23

  20. Process Automation: Moulding, Laser & Cleaning Pushing Performance � Moulding: g Moulding Moulding HARTING AG - Automated Handling Mitronics - Process Control (Temperature, Pressure) Nouhad Bachnak 3D MID Technology Technology Laser & Cleaning Laser & Cleaning � Laser & Cleaning: People | Power | Partnership - Automated Robot Cell - Continuous Process Control 2010-09-29 S. / 20 23

  21. Process Automation: Metallisation, Electronic Assembly Assembly Pushing Performance � Metallisation: Metallisation HARTING AG Mitronics - Semi automated Batch Handling Semi automated Batch Handling - Automated Bath Control Nouhad Bachnak 3D MID Technology Technology Electronic Assembly � Electronic Assembly: - Inline Manufacturing - Continuous Tracking of Process Parameter C ti T ki f P P t People | Power | Partnership 2010-09-29 S. / 21 23

  22. Conclusion Pushing Performance HARTING AG Mitronics � Increasing product quality and � Higher Production Output increasing yield due to process due to Automation optimisation and process control Nouhad Bachnak 3D MID � Increasing technology know how and increasing automation allow � Increasing technolog Technology Technology kno ho and increasing a tomation allo an economical manufacturing of high reliable 3D-MID Products People | Power | Partnership 2010-09-29 S. / 22 23

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