2020 Interim Results Announcement 29 July 2020
Disclaimer These forward-looking statements reflect the Company’s current expectations, The information contained in this presentation is provided for informational purpose only, and should not be relied upon for the purpose of making any beliefs, hopes, intentions or strategies regarding the future and assumptions in investment or for any other purpose. light of currently available information. Such forward-looking statements are Some of the information used in preparing this presentation was obtained not guarantees of future performance or events and involve known or from third parties or public sources. The information contained in this unknown risks and uncertainties. Accordingly, actual results may differ presentation has not been independently verified. No representation or materially from information contained in the forward-looking statements as a warranty, expressed or implied, is made as to, and no reliance should be result of a number of factors. You should not place undue reliance on such placed on, the fairness, reasonableness, accuracy, completeness or forward-looking statements, and the Company does not undertake any correctness of such information or opinions contained herein. It is not the obligation to update publicly or revise any forward-looking statements. No intention to provide, and you may not rely on this presentation as providing, statement in this presentation is intended to be or may be construed as a profit a complete or comprehensive analysis of our financial or trading position or forecast. prospects. The information and opinions contained in this presentation are We also do not undertake any obligation to provide you with access to any provided as at the date of this presentation and are subject to change additional information or to update this presentation or any additional without notice and will not be updated to reflect any developments which information or to correct any inaccuracies in this presentation or any additional may occur after the date of this presentation. information which may become apparent. All statements, other than statements of historical facts included in this This presentation does not constitute an offer or invitation to purchase or presentation, are or may be forward-looking statements. Forward-looking subscribe for any shares and no part of it shall form the basis of or be relied statements include, but are not limited to, those using words such as upon in connection with any contract, commitment or investment decision in “seek”, “expect”, “anticipate”, “estimate”, “believe”, “intend”, “project”, relation thereto. “plan”, “strategy”, “forecast” and similar expressions or future or conditional verbs such as “will”, “would”, “should”, “could”, “may” and “might” . 2
A W A R D S Awards & Accolades 3
O V E R V I E W Th e World’s SMT Solutions 36.6% Technology & Market Leader Materials Q2 2020 Group Revenue: 13.3% Semiconductor USD 557m Solutions 50.1% 4
ASMPT’S O V E R V I E W Major Facilities Around The World Huizhou ( 惠州 ) Regensburg Fuyong ( 福永 ) Longgang ( 龙岗 ) Weymouth Taoyuan Munich Sales Offices Business Centre / R&D / Beuningen Manufacturing Site Boston Hong Kong Porto Chengdu ( 成都 ) >1,400 10 12 >2,000 Patents on leading R&D centres Manufacturing Global R&D Singapore edge technologies worldwide facilities staff Johor 5
Three Business Segments With O V E R V I E W Leading Market Positions SMT SOLUTIONS # 2 in SMT Equipment Market SEMICONDUCTOR 2019 Worldwide SOLUTIONS 1 SMT Market Share: # 1 in Assembly ~22% & Packaging Equipment Market Since 2002 2019 Worldwide MATERIALS PAE Market Share: # 3 in Leadframe ~29% Market 2018 Worldwide Leadframe Market Share: ~9% 1 F O R M E R L Y B AC K E N D E Q U I P M E N T S O L U TI O N S Sources: VLSI, SEMI and ASMPT Market Intelligence | 6
Our Strategic Value-added Acquisitions Manufacturing Execution Software Advanced Packaging Silicon Photonics Largest installed base of panel Ultra high precision sub-micron die Provider of automation and Well-established MES solutions deposition tools attach equipment solutions manufacturing software for high- provider with a strong presence in tech industries China. Addition to the Advanced In prime position to capture Capture demand for SMART Complements Critical Packaging suite of solutions demand for future data centre bandwidth growth and next Factory software solutions Manufacturing MES solutions, High Performance Computing reinforcing ASMPT’s position in generation 5G deployments (HPC) the China market. 7
Our Participation in Emerging and Disruptive Technologies Minority Investments Strategic Collaborations in Start-ups AI Chip Technology X-ray Inspection 3D Laser Printing Data Analytics X-ray inspection of Israeli company with advanced semiconductor cutting-edge packages technology Industrial IoT Solutions to deliver holistic data analytics Development of Up to 100X faster vs Potentially disruptive solutions Heterogeneous Integration conventional X-ray using technology to the (HI) to advance packaging proprietary technology SMT printing industry Provide customer value through technologies and tools productivity, quality and reliability in manufacturing operations 8
Q 2 2 0 2 0 H I G H L I G H T S 2020 Q2 Highlights
Q 2 2 0 2 0 H I G H L I G H T S Q2/1H 2020 Billings Group 1H Group Billings ~US$1B ▲ 5.9% YoY ▼ 10.5% HoH Q2 1H USD QoQ YoY USD HoH YoY Q2 Group Billings ▲ 19.5% YoY ▲ 27.8% QoQ Group 992m -10.5% +5.9% 557m +27.8% +19.5% SEMI Key drivers for Q2 YoY billings growth Advanced Packaging Semi NEXX delivered strong growth Solutions 473m -4.5% +16.6% 279m +43.0% +33.8% Segment Other drivers: Optoelectronics and IC/Discrete Traditional wire/die bonders delivered relatively Materials 126m -3.2% +15.6% 74m +43.2% +28.2% strong growth Segment CIS billings relatively weaker due to soft smartphone market demand SMT Solutions 204m +8.0% +2.2% 393m -18.7% -6.9% Segment SMT Driven by 5G & SiP applications 10
Q2 2020 Billings – Business Segments Q 2 2 0 2 0 H I G H L I G H T S QoQ Growth: QoQ Growth: QoQ Growth: +43.0% +8.0% +43.2% Semiconductor Solutions SMT (USD’M) Materials (USD’M) (USD’M) 400 350 80 74 350 300 300 279 60 250 250 204 200 200 40 150 150 100 100 20 50 50 - - Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 - Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 16 16 16 16 17 17 17 17 18 18 18 18 19 19 19 19 20 20 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 16 16 16 16 17 17 17 17 18 18 18 18 19 19 19 19 20 20 16 16 16 16 17 17 17 17 18 18 18 18 19 19 19 19 20 20 11
Q 2 2 0 2 0 H I G H L I G H T S Q2/1H 2020 Group Bookings Group 1H Bookings ▲ HoH and YoY Q2 Bookings ▼ QoQ and YoY as a result of overall weak sentiment due to COVID-19 Q2 1H USD QoQ YoY USD HoH YoY SEMI Q2 Bookings ▼ QoQ due to higher Q1 base Key drivers of Q2 Bookings -21.6% 1,141m +19.0% +7.4% Group 472m -29.4% Advanced Packaging Optoelectronics and IC/Discrete Q2 Bookings for CIS relatively weaker due Semi to soft smartphone market 537m +21.7% +14.2% Solutions 227m -26.7% -8.1% Segment SMT Key driver of Q2 Bookings Materials 5G-related investments in China 167m +25.2% +59.3% 78m -11.8% +32.7% Segment SiP Q2 Bookings in Automotive and Industrial Applications were weak SMT Solutions 437m +13.7% -10.3% 167m -38.4% -43.7% Materials Segment Q2 Bookings at high level despite decline QoQ after 5 consecutive quarters’ growth 12
Q2 2020 Bookings – Business Segments Q 2 2 0 2 0 H I G H L I G H T S QoQ Growth: QoQ Growth: QoQ Growth: -38.4% -11.8% -26.7% Semiconductor Solutions Materials (USD'M) SMT (USD'M) (USD’M) 100 350 450 90 300 78 400 80 350 250 70 300 60 200 167 250 227 50 150 200 40 150 30 100 100 20 50 50 10 0 0 0 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 16 16 16 16 17 17 17 17 18 18 18 18 19 19 19 19 20 20 16 16 16 16 17 17 17 17 18 18 18 18 19 19 19 19 20 20 16 16 16 16 17 17 17 17 18 18 18 18 19 19 19 19 20 20 13
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