Updates on the FBK and HPK SiPMs and summary of the meeting in Milano-Bicocca Francesco Terranova PDS Consortium meeting 14 Jan 2020 More details in: A. Montanari, F. Terranova, “Planning for the SiPM tests in the DUNE pre-production phase” to appear in docdb
Hamamatsu (HPK) • Order for the production of four splits (25 sensors per split) funded by the University of Milano-Bicocca and placed in October OK • Order for the production of 250 sensors per split funded by the Czech DUNE group. Placed at CERN OK • Frequent contacts between DUNE and Hamamatsu Japan (through the Italian and US HPK branches) to define the details of the splits. Completed in Dec 2019. OK • Delivery date: officially confirmed by HPK on 23 Dec 2019: the 25 sensors of the four splits will be delivered in the first half of April • 250 sensors: TBD (most likely in June) 2
The four HPK spilts: • All splits will be based on the S13360 chip (Vbk = 50 V at 300 K), terminal capacitance 1.28 nF per sensor, 61.4 nF per 48 sensors. • All splits will be based on the HWB technology • Packaging: we asked HPK to perform a thermomecanical study on epoxy versus silicon resin (see below). Results indicate that silicon resin is slightly better. We chose silicon resin . Cell pitch: 50 and 75 m m • [already fixed in July] • Quenching resistance: HQR= 4 LQR . 3
FBK • Order for the production of twelve wafers (about 3000 sensors in total) funded by INFN and placed OK • This order include the packaging of 25 sensors per split for early tests and 250 sensors per split for the reliability tests OK • Frequent contacts between DUNE and FBK to define the details of the splits. Decision taken in Dec 2019. OK “Standard DUNE split” : 30 m m cell pitch, 6x6 mm 2 sensors in • NUV-HD-Cryo. Packaging: epoxy resin in SMD package. Most conservative option (DarkSide-like) fulfilling all DUNE specs “Triple trench split ” 50 m m, low cross-talk due to additional SiO 2 • trenches. • To save time and validate the full chain , the wafer will be produced by LFoundry (subcontractor of FBK), as for the DUNE mass production. 4
FBK Delivery schedule: Wafer production: january-march Packaging of 25 sensors per split in FBK at single SiPM level: April. Delivery of 250 sensors: TBD, most likely in June In a nutshell: both FBK and HPK can provide the 25 sensors per split in time for the 60% readiness review (end of May) 5
Meeting in Milano-Bicocca On Dec 12-13, we held in Milano-Bicocca the first meeting of all European groups involved in the PDS. We put special emphasis on the activities that may be carried on in Spain (Madrid, Valencia and Granada), which joined the Consortium very recently. Aim of the workshop: • Provide a general overview of the status of the PDS and especially photosensors, cold electronics, warm electronics, integration • Prepare for the characterization of the splits (see above) and the sharing of the responsibilities • Distribute information on the cold electronics in order to set up standards for The characterization of the splits - The optimization of the cold electronics for FBK and HPK - 6
• Distribute information on the mechanics of the modules to prepare the design of the SiPM board and signal lead board • Discuss integration issues and start the process to identify the engineer in charge of integration Outcome: 7
Contents: • Identification of the measurements for the 25 sensor split and sharing of the samples • Standardization of the procedure for cooling and characterization (instruments and precision) • Identification of the measurements for the 250 sensor splits (mostly I-V curves and thermal tests in sensors directly embedded in the SiPM board developed by Milano-Statale) Ganging tests with sensors in catalog (e.g. S13360 TSV – Spain • - or S14160 in HWB – Italy) while waiting for the DUNE splits • Test of final configuration and of a full X-Arapuca by summer • Test of a half-module by the 90% readiness review We plan to discuss all these items in a dedicated session (PDS-photosensors) at the next Collaboration Meeting 8
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