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SinkPAD TM Thermally Efficient PCB Technology for Th ll Effi i t - PowerPoint PPT Presentation

Jul 23, 2023 •379 likes •652 views

Patent Pending Patent Pending SinkPAD TM SinkPAD TM Thermally Efficient PCB Technology for Th ll Effi i t PCB T h l f the LED Application Sinkpad Corporation R3 Users of SinkPAD TM technology are reminded that they bear the

  1. Patent Pending Patent Pending SinkPAD TM SinkPAD TM Thermally Efficient PCB Technology for Th ll Effi i t PCB T h l f the LED Application Sinkpad Corporation R3 Users of SinkPAD TM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to be accurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makes 1 no warranties as to the applicability, fitness or suitability of SinkPAD TM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind.

  2. PRESENTATI ON OUTLI NE  Thermal Challenges In The LED Applications  How it is Addressed? Metal Back PCB Technology  Is There a Better Way? SinkPAD TM Technology y gy  What Would I Gain Using SinkPAD TM ?  Comparisons Of “Metal Back” & “SinkPAD TM ”  Comparisons Of Metal Back & SinkPAD TM  Potential Applications  Test Data  Conclusion 2 R3

  3. THERMAL CHALLANGES  Increasing Trend For LED Power  Increasing Trend For LED Power  Increasing Trend For Higher Brightness  Primary Thermal Path: Conduction Cooling  Higher Thermal Resistance  Power Density Increasing – more LEDs in a small area  Long Life Expectation  Long Life Expectation 3 R3

  4. How Heat I ssues Addressed Historically?  Metal Back PCB Technology THERMALLY CONDUCTIVE DIELECTRICS  Arlon 92ML – 2.0W/m.k Example: MCPCB, Aluminum PCB etc…type products Example: MCPCB, Aluminum PCB etc…type products  Bergquist – 2.2-3.0W/m.k  Doosan – 2.0W/m.k  Denka Hit Plate – 2.0-8.0 W/m.k  DuPont CoolLam – Polyimide based – 0.80W/m.k  ITEQ- IT859 GTA – 2.0W/m.k  Laird Technology HKA 3 0W/m k  Laird Technology HKA – 3.0W/m.k  Polytronics – 2.7W/m.k  Sekisui – 2.0W/m.k  Ventec - VT 4A1 – 1.6W/m.k Thermally Conductive Dielectric Thermally Conductive Dielectric (TC~ 1 to 4 W/m.k) Z-axis Heat Z-axis Heat Thermal Pad Thermal Pad or Bond Pad Transfer rate: Metal Thermal Conductivity (TC) Only 1-4 W/m.k Al ~ 135-180W/m.k Cu ~ 385W/m.k Z-axis heat transfer is limited by the TC & thickness of the Dielectric Material R3 4

  5. 5 I s There a Better Way to Remove Heat? SinkPAD TM Technology SinkPAD TM Technology YES R3

  6. 6 SinkPAD TM is a MCPCB Technology gy Direct Thermal Path to Hot LED Direct Thermal Path to Hot LED What is SinkPAD? Which Provides R3

  7. “ SinkPAD SinkPAD TM TM ” TECHNOLOGY Patent Pending  Direct Heat Transfer To view & download this info “Register” below Register below. I f you already have Registered before; click on “login” below Or send an email request at q eng@sinkpad.com Z-axis Heat Transfer rate: Metal Thermal Conductivity (TC) 150-385 W/m.k Al ~ 135-180W/m.k Cu ~ 385W/m.k Cu 385W/m.k Z-axis heat transfer is same as the TC of the base material used R3 7

  8. What would I gain using SinkPAD? SinkPAD PCB will Lower LED Junction Temperature Which means : 1) O ti 1) Option to run LED at lower junction temperature t LED t l j ti t t  i.e Increase Life of the LED Fixture 2) Option to run LED at higher power / maintain temperature  i.e. Get more lumens per LED 3) Reduce number of LEDs to get same light 3) R d b f LED li h  i.e. Reduces Fixture Cost 4) 4) Hi h Higher Drive Currents, Brighter Light, Fewer Components D i C t B i ht Li ht F C t 8 R3

  9. “ SinkPAD SinkPAD TM TM ” TECHNOLOGY Patent Pending  Top View of a SinkPAD SinkPAD TM TM PCB SinkP SinkPAD D Circuit pad Circuit traces 9 R2

  10. TM Product Family SinkPAD SinkPAD TM Patent Pending SinkPAD P/ N Base Metal Base Metal thickness SP-A530 ALUMINUM 5052 ~ 0.032” (~ 0.80mm) SP-A540* ALUMINUM 5052 ~ 0.040” (~ 1.0mm) SP-A560* ALUMINUM 5052 ~ 0.063” (~ 1.60mm) SP-A630 ALUMINUM 6061 ~ 0.032” (~ 0.80mm) SP A640 SP-A640 ALUMINUM 6061 ALUMINUM 6061 ~ 0.040” (~ 1.0mm) 0.040 ( 1.0mm) SP-A660 ALUMINUM 6061 ~ 0.059” (~ 1.50mm) SP-C40 COPPER ~ 0.040” (~ 1.0mm) SP-C60 COPPER ~ 0.059” (~ 1.50mm) * Most running product 10 R3

  11. COMPARI SI ON OF “METAL BACK” & “ SinkPAD SinkPAD ” Patent Pending TM PCB “ SinkP SinkPAD TM PCB ” “Metal Back PCB” To view & download this info To view & download this info “Register” below. I f you already have Registered before; click on “login” below Or send an email request at eng@sinkpad.com  Higher Thermal Resistance  Direct Thermal Path  Slow Heat Transfer Rate  Fast Heat Transfer Rate  Standard Dielectric Used  Special Dielectric Required  Thinner Base Metal Options  Thick Base Metal Required p q  Epoxy, Polyimide or any typical dielectric can be  Limited to Epoxy dielectric only  Metal is Insulated Thermally From The used  Metal is Connected Thermally to the Component Component  “No” PCB Design Change Required  No PCB Design Change Required 9 R5

  12. “ SinkPAD SinkPAD TM TM ” TECHNOLOGY Patent Pending  Multilayer Examples TM PCB TM PCB “ SinkP SinkPAD TM SinkP SinkPAD TM PCB PCB ” “Metal Back PCB” “ l k C ” Does not increase thermal resistance Substantial increase in thermal resistance To view & download this info “Register” below. I f you already have Registered before; click on “login” below Or send an email request at eng@sinkpad com eng@sinkpad.com Limitation: Components can be assembled only on one side of the PCB 12 R3

  13. REQUI REMENT TO USE SinkPAD SinkPAD TM TM T To view & download this info i & d l d thi i f “Register” below. I f you already have Registered before; click on “login” below Or send an email request at eng@sinkpad.com 13

  14. 14 POTENTI AL APPLI CATI ONS  Commercial / I ndustrial lights R3

  15. 15 POTENTI AL APPLI CATI ONS  Street lights R3

  16. 16 POTENTI AL APPLI CATI ONS  Back lights R3

  17. 17 POTENTI AL APPLI CATI ONS  PAR38 bulbs R3

  18. 18 POTENTI AL APPLI CATI ONS  Residential down lights R3

  19. 19 POTENTI AL APPLI CATI ONS  LED Packaging Substrate R3

  20. TEST DATA  SinkPAD v/s MCPCB thermal data SinkPAD R th : 0.45 0 C/W th MCPCB R th : 1.75 0 C/W th deg C) deg C) dT * dT * Power (W) Power (W) SinkPAD TM makes a lot of sense at mid to high power application, for example the new Cree XML can be driven up to 3A. At this power level, It can be a big difference in junction temp 20 R5

  21. TEST DATA, Cree 1-XPG  SinkPAD v/s Typical Aluminum back PCB thermal data 21 R5

  22. TEST DATA, Cree XP-G  SinkPAD v/s Conventional MCPCB thermal data (IR Camera) - Cree XPG 9 LEDs - Current: 1 Amp. SinkPAD PCB MCPCB - Power: 3W each - PCB ~ 1”x1” To view & download this info To view & download this info “Register” below. I f you already have Registered before; click on “login” below Or send an email request at eng@sinkpad.com 119 0 C 141 0 C SinkPAD TM PCB & Aluminum PCB mounted onto a separate heatsink. LEDs on a SinkPAD TM pcb running ~22 0 C cooler than on the conventional MCPCB 22 R3

  23. TEST DATA, Luxeon Rebel at 700mA  SinkPAD v/s Conventional MCPCB thermal data (Thermocouple method) - Luxeon Rebel at 700mA Luxeon Rebel at 700mA MCPCB Type-1 MCPCB Type 1 MCPCB Type-2 4 MCPCB-1 MCPCB 1 MCPCB-2 Test was conducted by Quadica Developments Inc LED on a SinkPAD TM PCB running ~29 0 C cooler than on the MCPCB-1 and 10 0 C cooler than the MCPCB-2 23 R5

  24. TEST DATA, Luxeon Rebel at 1A  SinkPAD v/s Conventional MCPCB thermal data (Thermocouple method) - Luxeon Rebel at 1000mA Luxeon Rebel at 1000mA MCPCB Type-1 MCPCB Type-1 MCPCB Type-2 4 MCPCB-1 MCPCB-2 Test was conducted by Quadica Developments Inc LED on a SinkPAD TM PCB running ~47 0 C cooler than on the MCPCB-1 and 16 0 C cooler than the MCPCB-2 24 R5

  25. Other Available Test Data  Nichia N219  Luxeon Rebel  Luxeon Rebel  Cree MTG  Osram Oslon SSL  Osram Oslon SSL  Cree XML Customize Your Test Customize Your Test 25 R5

  26. Highlights and Q&A Patent Pending  Magnitude Higher Thermal Transfer Rate  Direct Thermal Path  Direct Thermal Path  135 to 385W/m.k vs. 1 to 4 W/m.k  LOWER JUNCTION TEMPERATURE  High Tg (Up to 225 o C)  Multilayer Possible Without Increase In Thermal Resistance  Weight Saving  Possibly thinner profile  Direct Replacement for MCPCB, Metal Back PCB & Aluminum PCB  Di t R l t f MCPCB M t l B k PCB & Al i PCB  Most Economical Direct Thermal Path Solution  Any Questions….. Contact us y Q 26 R5

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