Problem Prototype and Production Test Applications demand high - PowerPoint PPT Presentation

Problem Prototype and Production Test Applications demand high bandwidth followed by high compliance, low resistance and high temperature. • Elastomers have high bandwidth • Elastomers have low resistance • Elastomers have low compliance • Due to small thickness and mechanical coupling • Elastomers have limited temperature range • Due to the inherent process of silicone rubber IP, Apr2011

Solution - SM Contact SM is a new elastomer technology that has silver balls held in a conductive column like buttons which are embedded in a non-conductive silicone rubber on a proper pitch that provides high compliance and extreme temperature ranges. The non-conductive rubber has a core in the middle to enable compression stop feature. SM is available for BGA, LGA, QFN, PoP and other packages from 0.25mm to 1.27mm. Relaxed Actuated �������� � Cross Section - Silver Particles POP Interposers Array of Columns - Elastomer Matrix IP, Apr2011

Solution - SMP Contact The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP. SMP is for ATE production test and is available for BGA, LGA, QFN, PoP and other packages from 0.25mm to 1.27mm. 0.63 mm m 0. SMP SM Actuated Top Side Bottom Side Tips Pierce Tails Compress DUT SM Columns IP, Apr2011

SM/SMP Contact - Typical Characteristics � Contact resistance <15 mOhms � Bandwidth >40GHz @-1dB � Self Inductance <0.21nH @ 10GHz � Mutual inductance <0.10nH � Capacitance to ground <0.15pF � Capacitance to ground <0.15pF � Mutual capacitance <0.04pF � Force 25-45grams per contact � Operating temperature -55 to +155°C � Insertion/Extraction cycles >500,000 � Current rating >4A per contact � Contact length (compressed): 0.45mm � Compliance: 0.25mm IP, Apr2011

SM Contact Bandwidth Data – 0.5mm Pitch S11 (f) S21 (f) 0 1 -5 0 -10 -1 1 [dB] -15 -2 [dB] -20 -20 -3 -3 S21 [d S11 [ -25 -4 -30 -5 -35 -6 -40 -7 -45 -8 0 20 40 0 10 20 30 40 f [GHz] f [GHz] GW N 502 G W N 502 Insertion Loss -1dB @ 40GHz Return Loss -15dB @ 22GHz Note: 0.5mm MLF Electrical Characterization Performed with previous version SM contact IP, Apr2011

SM Contact Current Data – 0.5mm Pitch Temperature rise as a function of drive current I 16 14 12 4 Amps @ 14C Heat Rise 10 10 dT [deg C] 8 6 4 2 0 0 1 2 3 4 5 GWN 404 I [A] Note: 0.5mm MLF Electrical Characterization Performed with previous version SM contact IP, Apr2011

SM Contact Temperature Data – 1.27mm LGA Note: Temperature Specifications for SM contact is -55C to +155C IP, Apr2011

SM Contact Endurance Data – 0.5mm QFN 0.5mm Pitch QFN Vertical Plunge Cycler, Gold plated device simulator and Gold plated load board @ Room Temp (Ambient) 1 0.004826 0 0.652853 0.452899 0.418984 0.372352 0.340557 0.331372 252 0.00412 C400 44-LEAD QFN 0 0.681115 0.436648 0.357515 0.341264 0.347623 0.36458 503 503 0.004762 0.004762 0 0 1.668166 1.668166 0.620351 0.620351 0.430289 0.430289 0.369526 0.369526 0.329253 0.329253 0.344797 0.344797 754 0.005661 0 32.8009 0.753889 0.450779 0.409093 0.359634 0.337025 Resistance (Ohms) 1005 0.004762 0 2.291343 0.63095 0.40556 0.369526 0.375885 0.359634 0.016 1256 0.004874 0 1.908393 0.844328 0.443714 0.374472 0.339144 0.306643 0.014 1507 0.00473 0 1.232224 0.579371 0.420398 0.368113 0.332785 0.350449 0.012 1758 0.005404 0 1.391905 0.587143 0.453605 0.397788 0.365993 0.331372 0.01 2009 0.005501 0 45.00939 0.751063 0.447953 0.402027 0.388603 0.357515 0.008 2260 0.004971 0 1.64485 0.605514 0.40768 0.378711 0.313708 0.330666 0.006 2511 0.004377 0 0.862698 0.450073 0.349743 0.352569 0.353982 0.371646 0.004 2762 0.004441 0 1.100806 0.551816 0.40768 0.355395 0.337731 0.353275 0.002 3013 0.005228 0 1.246355 0.525674 0.462791 0.390016 0.404147 0.368819 0 3264 0.005099 0 2.842453 0.691006 0.426757 0.384363 0.392136 0.365287 3515 0.004682 0 1.038629 0.505184 0.425343 0.365993 0.332785 0.326426 1 14057 28113 42169 56225 70281 84337 98393 112449 126505 140561 3766 0.004826 0 1.853989 0.591383 0.408386 0.372352 0.383657 0.349036 4017 0.004666 0 1.520497 0.58573 0.390016 0.365287 0.365993 0.390722 4268 0.004923 0 60.92514 0.864111 0.467736 0.376591 0.378005 0.378005 Cycles 4519 0.004762 0 1.117056 0.541218 0.413332 0.369526 0.337025 0.356101 IP, Apr2011

SM Contact Endurance data with real devices to understand contact resistance without cleaning C400: BGA / LGA: SnCuAg vs. SnPb Plating 0.250 0.250 BGA SnPb OHMS / LEAD 0.200 LGA SnPb 0.150 0.100 BGA SnCuAg 0.050 LGA SnCuAg 0.000 250 500 750 1,000 1,250 1,500 1,750 2,000 2,250 2,500 2,750 3,000 3,250 3,500 0 ACTUATIONS (no cleaning) 8/09 IP, Apr2011

SM Contact 5K Endurance data with real devices showing the effects of cleaning C400: BGA (Effect of Cleaning) 0.200 at 0K hits 0.175 0.175 D OHMS / LEAD 0.150 at 5K -no clean 0.125 0.100 0.075 at 5K -air 0.050 cleaned, then 0.025 retested 0.000 SnPb SnCuAg Static (Manual) tests 8/09 IP, Apr2011

SMP QFN Contact – Temperature Data 0.5mm Pitch, 44QFN + 16 GND, Delta RFS Handler Tri-Temp Cycling, (Ambient, +150 ° C, -50 ° C) +25C – Ambient Test A MB IE NT D E LTA R FS - 0.5mm MLF - C 200 +25C – Ambient Test 0.0250 0.050 Avg Std Dev 95% Level Av g 0.0200 0.040 Stdev C R E S (O h m s ) HMS . 0.030 0.0150 O 0.0100 0.020 0.0050 0.010 0.0000 0.000 0 5 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 9 9 1 1 1 1 1 0 50 100 150 200 250 0 0 5 0 5 0 5 0 5 0 5 0 5 0 5 0 5 0 5 0 0 1 1 2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 5 0 5 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 C Y C LE S (000) Cycles +150C D E LTA R FS - 0.5mm MLF - C200 -50C D E LTA R FS - 0.5mm MLF - C 200 +150C – HOT Test -50C – COLD Test 0.050 0.050 Av g Av g 0.040 0.040 Stdev Stdev MS . MS . 0.030 0.030 H H O O 0.020 0.020 0.010 0.010 0.000 0.000 0 50 100 150 200 250 0 50 100 150 200 250 C Y C LE S (000) CY C LE S (000) IP, Apr2011

SMP BGA Contact – Endurance Data CRES 0.5mm 518 BGA - 500K Cycles Ohms 0.1100 0.1000 0.0900 Avg Std Dev 95% Level 0.0800 0.0700 0.0600 0.0500 0.0400 0.0300 0.0200 0.0200 24.00 24.00 0.0100 22.00 0.0000 20.00 0 50000 100000 150000 200000 250000 300000 350000 400000 450000 500000 18.00 Cycles 16.00 cres (milliohms) 14.00 12.00 10.00 8.00 6.00 4.00 ave cres 1.27mm 479 BGA – 250K Cycles, Ambient Test ave+2std dev 2.00 95%tile 0.00 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240 250 cycles (K) IP, Apr2011

SM/SMP Value Proposition � Low cost elastomer solution for 0.25mm to 1.27mm pitch devices � Extreme temperature solutions (-55 to +155C) � High power applications (excellent current rating of 4A@14C rise) � High speed digital and RF applications (excellent bandwidth >40GHz) � Reliable test data due to stable contact resistance throughout life cycle � High compliancy for large package warpage � Mixed pitch and non-conventional array solutions for densely � Mixed pitch and non-conventional array solutions for densely populated devices at low cost � SM contact provides superior compliance in all lab and evaluation applications due to individual button technology at affordable cost � SM sockets with wide temperature range are available in same footprint as other Ironwood sockets � Custom test socket can be produced using SM contact in less than 3 weeks when standard socket is not available � SM sockets are robust and can be used in demonstration products for multiple handling process without contact degradation � SMP sockets are proven in ATE applications IP, Apr2011

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