HI-TECH CORP. HI-TECH CORP. PRINTED CIRCUIT BOARDS The Company - PDF document

HI-TECH CORP. HI-TECH CORP. PRINTED CIRCUIT BOARDS

The Company Facts: Facts: Hi-Tech Corp. is a East-European manufacturer Hi-Tech Corp. is a East-European manufacturer - Hi-Tech Corp. is - Hi-Tech Corp. is of Printed Circuit Boards of Printed Circuit Boards specialized for specialized for privately owned by Mr. privately owned by Mr. express delivery of prototypes and small series express delivery of prototypes and small series Savo Stankovic since Savo Stankovic since of Rigid, Rigid-Flex and Flex multilayer Circuit of Rigid, Rigid-Flex and Flex multilayer Circuit 1981 1981 Boards. Boards. - - The company exists for The company exists for 31 year as a Printed 31 year as a Printed Facilities Facilities Circuit Board Circuit Board • • Land area . . . . . . . . . . . . . . . . . . .16000 m2 Land area . . . . . . . . . . . . . . . . . . .16000 m2 manufacturer manufacturer • • Administration building . . . . . . . . .800 m2 Administration building . . . . . . . . .800 m2 • • Production building . . . .. 8200 + 2200 m2 Production building . . . .. 8200 + 2200 m2 - - Exports to the Exports to the • • Clean rooms . . . . . . . . . . . . . . . . . .600 m2 Clean rooms . . . . . . . . . . . . . . . . . .600 m2 European market for 23 European market for 23 • • Storage area . . . . . . . . . . . . . . . . . 400 m2 Storage area . . . . . . . . . . . . . . . . . 400 m2 years years • • Pure water plant/waste water treatment Pure water plant/waste water treatment 600 m2 600 m2 • • - - 100 % of the products 100 % of the products Additional area . . . . . . . . . . . . . . . 2500m2 Additional area . . . . . . . . . . . . . . . 2500m2 produced are exported produced are exported to EU, USA and other to EU, USA and other countries countries - - Currently the company Currently the company employs 160 people, of employs 160 people, of whom majority are whom majority are engineers engineers 2

Company growth The company growth is based on the The company growth is based on the following pillars: following pillars: 1. Specialization in small and medium 1. Specialization in small and medium sized orders sized orders Our equipment is set for production Our equipment is set for production of of large large number number of of Complex Complex Prototypes Prototypes orders orders to to small small and and medium quantities. medium quantities. 2. Creation of mutually beneficial 2. Creation of mutually beneficial partnerships partnerships With the customer-base of over With the customer-base of over 6000 companies we are proud to say 6000 companies we are proud to say that each customer receives special that each customer receives special attention. attention. 3. Know-how focus 3. Know-how focus We are focused on upholding and We are focused on upholding and upgrade of technological know-how. upgrade of technological know-how. Continuous improvement on each Continuous improvement on each level is our maxim. level is our maxim. 4. Pro-active approach 4. Pro-active approach A highly qualified team combined A highly qualified team combined with years of production know-how with years of production know-how ensures that your boards are what ensures that your boards are what you expect from it - quality and fast you expect from it - quality and fast service. service. 3 Photo`s are property of Hi-Tech Corp. and can`t be reproduced

Capacity • • Double side PCB: 10.000 m2/year Double side PCB: 10.000 m2/year • • Multilayer PCB: Multilayer PCB: 30.000 m2/year 30.000 m2/year • • Production according to IPC-A- Production according to IPC-A- 600-H (up to class 3) or 600-H (up to class 3) or customer specifications customer specifications • • UL certified production UL certified production • • Production in compliance with Production in compliance with RoHS and WEEE RoHS and WEEE • • ISO 9001, ISO 14001, ISO TS16494 ISO 9001, ISO 14001, ISO TS16494 certified certified Photo`s are property of Hi-Tech Corp. and can`t be reproduced 4

Product Range • • Rigid, Rigid-Flex and Flex Boards Rigid, Rigid-Flex and Flex Boards • • 2 – 36 layers 2 – 36 layers • • HDI boards HDI boards • • Impedance controlled PCB's Impedance controlled PCB's • • High Frequency Boards High Frequency Boards • • Thick Copper Boards Thick Copper Boards • • Sequential Lamination Stack Build Sequential Lamination Stack Build (SBU) (SBU) Photo`s are property of Hi-Tech Corp. and can`t be reproduced 5

Rigid Multilayers up to 36 layers • • Blind via 0.1mm Blind via 0.1mm • • Buried via 0.1 mm Buried via 0.1 mm • • Laser via 0.075mm Laser via 0.075mm • • Filling via (copper or non- Filling via (copper or non- conductive) conductive) • • Plugged (via-filler SD-2361) Plugged (via-filler SD-2361) • • Conductor width /space 0.035mm Conductor width /space 0.035mm • • PCB thickness < 0.1- 5.0 mm PCB thickness < 0.1- 5.0 mm • • Selective surface finish (ENIG Selective surface finish (ENIG /Hard Gold) /Hard Gold) • • Copper thickness 435 microns Copper thickness 435 microns (finish) (finish) Photo`s are property of Hi-Tech Corp. and can`t be reproduced 6

Flex and Rigid-Flex Multilayers • Maximum Flex layers - 10 • Maximum Flex layers - 10 • Maximum layers Rigid/Flex -20 • Maximum layers Rigid/Flex -20 • Sequential Lamination 2 – 6 cycles • Sequential Lamination 2 – 6 cycles and more and more • Bending radius 6-10 times PCB • Bending radius 6-10 times PCB thickness thickness • Build-up`s: Symmetrical and • Build-up`s: Symmetrical and Asymmetrical Asymmetrical • Minimum track /space • Minimum track /space >= 35 - 100 microns >= 35 - 100 microns • Material Polyimide: Pyralux DuPont • Material Polyimide: Pyralux DuPont • Base Copper : Min. 9 microns • Base Copper : Min. 9 microns Max.70 microns Max.70 microns • Surface finish Nickel/Gold (ENIG); • Surface finish Nickel/Gold (ENIG); Hard Gold (connectors) Hard Gold (connectors) 7 Photo`s are property of Hi-Tech Corp. and can`t be reproduced

Technical data (other) - - Blind / Buried via's >= 0.1 mm Blind / Buried via's >= 0.1 mm - - Depth-drilling +/- 10 µm (microns) Depth-drilling +/- 10 µm (microns) - Drilling (X-Ray) - Drilling (X-Ray) - - Min. IL thickness Min. IL thickness 0.063 mm 0.063 mm - - Minimal grid of testing points 50 µm Minimal grid of testing points 50 µm - - Max. AOI area 500 x 600mm Max. AOI area 500 x 600mm - - Min. detectable defect size 0.035 mm Min. detectable defect size 0.035 mm - - Track width IL 35 µm (microns) Track width IL 35 µm (microns) - - Spacing IL 35 µm (microns) Spacing IL 35 µm (microns) - - Track width OL 35 µm (microns) Track width OL 35 µm (microns) - - Spacing OL 35 µm (microns) Spacing OL 35 µm (microns) - - Laser drilling, minimum drill 0.05 mm Laser drilling, minimum drill 0.05 mm - - Aspect ratio 1:25 Aspect ratio 1:25 - - Surface: Electrolytic Sn, Ni/Au, Surface: Electrolytic Sn, Ni/Au, Immersion Ni/Au, HAL LF Immersion Ni/Au, HAL LF - - Materials: FR4 Tg 150 or HTg 180 , Materials: FR4 Tg 150 or HTg 180 , Rogers, Pyralux Polyimide and others Rogers, Pyralux Polyimide and others on request on request 8 Photo`s are property of Hi-Tech Corp. and can`t be reproduced

Express Service Double Flex/ Rigid PCB Sided PCB 5 days 10 days standard standard 1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 6 7 8 9 10 PRODUCTION DAYS PROTOTYPES Complex Multilayer PCB 7 days standard 9

What you get • • Express production for Express production for prototypes prototypes • • Series production Series production • • Next day delivery (within EU) Next day delivery (within EU) • • Free DFM check Free DFM check • • Technical support for your PCB Technical support for your PCB design design • • First Class base materials used – First Class base materials used – Fr4, Rogers, Pyralux (UL certified) Fr4, Rogers, Pyralux (UL certified) • • The value for money The value for money • • A partner with high technological A partner with high technological capability (equipment made in capability (equipment made in Germany and Japan) Germany and Japan) 10 Photo`s are property of Hi-Tech Corp. and can`t be reproduced

Product applications 11

Companies which products use PCBs manufactured by Hi-Tech 12

Contact us Hi-Tech Corp. s.Oresani 1000 Skopje, Macedonia Tel: + 389 2 2785120 Fax: + 389 2 2785147 E-mail: info@hitech.com.mk www. hitech.com.mk 13

Thank you Thank you for your interest in our for your interest in our company company 14