Corporate Presentation 2020 Core Values Engineering Manufacturing - PowerPoint PPT Presentation

Corporate Presentation 2020

Core Values Engineering Manufacturing Customer Service Solutions

Milestone Circular Connectors Expanded • IP54 - IP68 • First Responder/ Law Enforcement Electronics Interconnect Mechanical Division • Self-wiping Sockets Library Team Division Expanded • Custom Disposable Established Established • Design Capabilities Mechanical Division Established 2016 2017 2018 2019 • Fabrication 2015 Component Division Expanded • Power Transformers Component Division Component Division Component Expanded 2015 Packaging Expanded Division Expanded • High Speed I/O Systems • • Interconnect Components Magnetics • Push-Pull Circular Connector/ Established • Cable Assemblies Division Snap Latch Series 2012 2011 2014 2007 2006 Component Division Established Northern California Southern California PCB Layout Facility PCB Layout Facility 2005 2000 2002 Established Established Flex & Rigid- 1993 Flex PCB 1997 Established Established Established PCB PCB Division in Division in China Taiwan

Divisions PCB Layout PCB Packaging Systems PCB Layout Quick Turn High Speed Module Systems → Routing Service High Mix Low Volume System SI/PI Modeling → Library Service Medium to High Volume Enhanced Thermal Packaging Cloud Library Management Multilayer/Buildup Mechanical Design Thermal Analysis Components Mechanical Interconnect Solutions USB, SATA, HDMI, BTB Design & Fabrication Solutions Medical and Industry HDMI/USB Cable Assemblies Plastic Injection High Speed I/O Connectors RF, Memory Card, FPC, Power Cord Die-Cast Molding QSFP28, SFP28, QSFP+ Planar Transformers XFP, SFP+, SFP, MiniSAS HD Sheet Metal Stamping Push-Pull Connectors RJ45 W/ Magnetics Screw Machine Custom Cables Power Transformers, LAN Magnetics Cable & Wire Harness Turnkey Solution Spray Finishing

North America Sales Coverage Corporate Offices / Design Center: 2 Inside Sales: 22, QA: 5 Engineer: 20 Regional Sales Locations: 36 Sales Representatives: 99 Technical Sales: 13

Asia Factory & Sales Coverage PCB Factories Component Factories Mechanical Fabrication PalPilot Design Center & Alliance Partners Corporate Offices / Design Center: 2 Inside Sale: 20 SQI: 6 Regional Sales Locations: 6 Sales Representatives: 50

North America Revenue / 2009-2020* Revenue Totals Based on all Combined PalPilot Business Units 130 US$ Million 120 US$ Million 110 US$ Million 100 US$ Million 90 US$ Million 80 US$ Million 70 US$ Million 60 US$ Million 50 US$ Million * 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 *Projected

PalPilot Sales by Industry

PCB Layout

PCB Design Services PalPilot’s continuous resource-training and investments in state-of-the-art tools enable us to offer precision design services to meet the needs of today’s demanding product challenges. Key Features PCB Technologies Industry Applications • • • High-speed (>26Gbps/channel) Veteran PCB Designers SFP28, QSFP28 • • • High Density Close Interaction Infiniband • • • Highly Constrained Anywhere, Anytime XAUI • • • Flexible Schedule High-Layer (>40 layers) PCle Gen 3, PCle Gen 4 • • • 2000+ pin BGA Industry Leading Software Gigabit Ethernet • • • 0.35mm pitch Concurrent Engineering Collaboration Fibre Channel • • • Controlled Impedance Around-The-Clock Routing Support DDR3, DDR4 • • Backdrill RF and Microwave • • Blind and Buried Vias ATCA & Micro-TCA • HDI • Via-in-pad

Cloud Library Management Capabilities • Schematic Symbol Creation • Footprint Creation • IPC-7351, IPC-7251, JEDEC Standards • Custom Land Pattern – Z-Axis Dimension • 3D CAD Models Supported Platforms • OrCAD CIS • Concept HDL • Cadence Allegro • Solidworks and STEP Visit us:

PCB

Commitment to Quality PCB Fabrication Quick Turn, 5-10 Days from Asia High Mix Low Volume Medium to High Volume Multilayer/Build up Flex, Rigid-Flex Certifications UL ISO9001 (Quality System) IATF16949 (Automotive) ISO13485 (Medical) AS9100 (Aerospace) ISO14001 (Environmental) OHSAS18001 (Safety) Complete Solution Throughout Product Life Cycle Quick-Turn Volume Pre-Production Prototype Production

PCB Fabrication Capabilities RIGID BOARDS FLEX BOARDS Layers Layers 1 – 40L 1 – 12L Max Board Size Max Board Size 24” x 40” 8.6” x 13.8” Max Board Thickness Max Board Thickness .315” .040” without stiffener Min. Board Thickness 4L – 16 mil, 6L – 24 mil, Min. Board Thickness 4 mil 8L – 40mil, 10L – 48 mil, 12-16L – 63 mil Min. Line Width 3 mil HDI Boards Blind, Buried & Stacked Vias Min. Line Space 3 mil ≤50 OHMS = ± 5OHMS Impedance Control Min. Mechanical Drill 4 mil >50 OHMS = ± 10% ± 2 mil Outline (Laser) Tolerance Cover Layer Dams Aspect Ratio Mechanical 8 mil 15:1 | 35:1 (ATE) Flammability Min. Line Width 94V-0 2.5 mil ≤50 OHMS = ± 5OHMS Impedance Control Min. Line Space 2.5 mil >50 OHMS = ± 10% Min. Mechanical Drill / Pad 6 mil | 16 mil Min Laser Drill / Pad 4 mil | 10 mil PTH Dia. Tolerance ± 3 mil NPTH Dia. Tolerance ± 1 mil ± 3mil Hole Position Deviation ± 4 mil Outline Tolerance Solder mask Dams 3 mil Aspect Ratio Laser 1:1 Flammability 94V-0

PCB Fabrication Capabilities RIGID – FLEX METAL SUBSTRATE PCB Layers Aluminum Substrate, Copper Subs, Aluminum Substrate and 2 – 40L Copper Substrates Max Board Size 15.75” x 30.0” ± 0.05 Metal-Substrate Control Depth capability (mm) Board Thickness .00788” - .1968” Counter bore depth-controlled capability (mm) ± 0.10 ≤50 OHMS = ± 5OHMS Impedance Control Maximum copper weight (OZ) 12 >50 OHMS = ± 10% Min. Line Width 2.5 mil Min. Line Space 2.5 mil Min. Mechanical Drill / Pad 6 mil | 16 mil Min Laser Drill / Pad 4 mil | 10 mil Max Buried Via 8 Mil ± 3 mil PTH Dia. Tolerance NPTH Dia. Tolerance ± 2 mil ± 3mil Hole Position Deviation ± 4 mil SPECIAL PROCESSES Outline Tolerance Solder Mask Dams 3 mil Aspect Ratio Mechanical 20:1 Heat Sink Metal – Buried PCB Hybrid Lamination Aspect Ratio Laser 1:1 ViPPO Embedded Resistance Micro-Via Copper Fill Resin Fill Embedded Capacitance Heavy Copper UL – 6oz [Conductive and Non-Conductive]

PCB Fabrication Capabilities ATE / Burn-In Board Layers 2 – 80L Max Board Size 15.75” x 30.0” Board Thickness .093” - .250” DUT/Drill Pattern Pitch .0118” (.3mm) minimum Min. Line Width 2.5 mil Min. Line Space 2.5 mil Min. Mechanical Drill / Pad 4 mil | 10 mil Min Laser Drill / Pad 3 mil | 6 mil Inner Layer Spacing Pad/Trace 1.5 mil Aspect Ratio Mechanical 35:1 Stub Drilling Max Depth 0.30 (.3mm pitch) – 0.130 (.5mm pitch) Stub Drill Diameter 0.0079 (.3mm pitch) – 0.01(.5mm pitch) Surface Finish ENIG | ENIPIG | Hard Gold Selective Gold | Flash Gold Impedance Control ≤50 OHMS = ± 5OHMS >50 OHMS = ± 10%

PCB Fabrication – Materials & Surface Finish SURFACE MATERIAL LAMINATE FINISHES SUPPLIERS • Standard Tg FR-4 Isola • Leaded HASL • • Mid Tg FR-4 Sheng Yi • • Lead Free HASL • High Tg FR-4 ITEQ • Immersion Gold (ENIG) • • High Speed Materials Ventec • • Immersion Gold (ENEPIG) • Mixed Dielectric Constructions Nelco • Immersion Silver • • Halogen Free Panasonic • Immersion Tin • • High CTI Rogers • • Hard Gold (Fingers) • Taconic • Polyimide (adhesive, adhesiveless) • Selective Hard Gold Dupont • • PET / Polyester • Wire Bondable Soft Gold Taiflex • • Metal Core • Flash Gold • OSP • Carbon Ink

Packaging Systems

Packaging Systems IC Substrate • Coreless laminate Substrate • High Power Ceramic Substrate • Thin Film Ceramic Substrate • Glass Substrate Solutions (Development) Package Assembly Systems • Coreless Package Systems • High Frequency LNA/PA • Optical Package Solutions • SiP, 2.5D & POP Assemblies Substrate & Package Design Service

Packaging Systems PCB & Substrate SI/PI Modeling & Measurement • Insertion Loss • Return Loss • Eye Pattern Generation • Cross Talk Specialized Material Deployment • Next Generation Polyimide Laminate Systems • 25um via Generation, 25um L/S • High Conductivity ITO Replacement • High Transparency • High Conductivity • Low Cost

Interconnect Solutions

Interconnect Plastic Push Pull Mixed Contacts Watertight M12/ M8 Easy Clean Custom High Voltage Metal Push Pull IP68 Multiple Sizes Thread Locking Disposable Multiple Keying Features Push Pull Latching High Mating Cycles Touch Proof Color Codes PCB Mount Bayonet Locking EMI Protection Sterilizable Power & Signal Fast Data Transfer Break Away

Plastic Connectors PLASTIC CONNECTORS • • TOUCH PROOF DISPOSABLE • • LIGHT WEIGHT BREAK AWAY • • MIXED CONTACTS METAL TO PLASTIC • • CUSTOM OPTIONS COLOR KEYING • • OZONE FREE IP67 PROTECTION • • STERILIZABLE CUSTOM SOLUTIONS

Metal Shell Connectors METAL CONNECTORS • • HIGH MATTING CYCLES EASY CLEAN • • CUSTOM SLUTIONS QUICK DE-MATING • • 6 HOUSING STYLES THREADED LOCKING • • UP T0 64 CONTACTS RUGGED / ROBUST • • MIXED CONTACTS 90 DEGREE PCB • • IP68 PROTECTION 360 DEGRE SHIELDING