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W hile LED Drivers for Mobile Handsets Marketing - Analysis/ Strategy/ Roadm ap Proposal Tactical Marketing Div. AX XElite Elite Products Presentation Products Presentation A Major Segments Display by AXElite HDTVs, LCD TV/Monitors, LCD

  1. W hile LED Drivers for Mobile Handsets Marketing - Analysis/ Strategy/ Roadm ap Proposal Tactical Marketing Div. AX XElite Elite Products Presentation Products Presentation A

  2. Major Segments Display by AXElite • HDTVs, LCD TV/Monitors, LCD Module – Leading main solution: Trident, Genesis, MTK, M-Star – Products: LDO, Switcher(PWM converter), WLED backlight solution, Panel bias power • DSL / ADSL / VDSL Modems (1.16Mu xDSL vs 0.918Mu Cable in US for new subscribers in Q4’06) – Leading main solution: Conexant, Broadcom, TI, Mavell, Atheros – Products: LDO/Shunt, Switcher • WLAN (802.11a/b/g) APs – Leading SoC partners: Broadcom, Marvell, Atheros – Products: LDO/Shunt, Switcher • Mobile Handsets – Leading customers: mobile handsets OEMs/ODMs in Taiwan/China – Products: LDO/Reset IC, Charge pump, Switcher • Power Supply, Adapter – Leading customers: Mobility (Dell), CVS, Power One… etc. – Products: LDO, Switcher, Shunt regulator • Portable & Automobile Multimedia – Leading customers: Shinco, Malata, Mitac… etc. – Products: Infotainment, handheld GPS

  3. Mobile Handset – TAM Display

  4. Handset Display - SAM (M sets) Volume segment By function [No_Camera + Colour LCD] => 150/120/100** in ’07/’08/’09 LEDs needed for: LCD Backlighting, Keypad Illumination [Camera + Colour LCD] => 470/520/560** in ’07/’08/’09 LEDs needed for: LCD Backlighting, Keypad Illumination, Flash By LCD screen size [< 2.0”] => 400/330/310** in ’07/’08/’09 Number of LEDs used is less than 3 [2.0” ~ 2.5”] => 345/390/420** in ’07/’08/’09 Number of LEDs used is between 3 to 6 Assumption: sub-display in clam-shell type mobile handsets use light-guide for CSTN-LCD and OLED, hence no independent LED is needed to provide backlighting

  5. Strategies of Sales/Distributor (I) Reference Designs of Handset Chipset vendors w/o own PMU: Spreadtrum Comm, JadeTech, C2Micro, Realtek, Atheros, Via w own PMUs: TI, Freescale, Qualcomm, STM, Philips, Infineon, ADI, Agere, EMP, Nvidia, Marvell, MediaTek (Darts Tech) Reference Designs of LCD Module vendors Korea: Samsung, LPL Taiwan: Wintek Corp., Picvue Elect., Foxconn China: Kingsmith Airdata, Truly Semi., Foxconn Japan: Sharp, Toshiba

  6. Strategies of Sales/Distributor (II) OEMs & ODMs Promotion to OEMs with focus on tier-2 initially: Nokia, Motorola, Samsung, Sony Ericssion, LG, BenQ, Sagem, Lenovo, TCL Promotion to ODMs: Compal, Arima, FIH, LongCheer Promotion to EMS/CMs: FIH, Flextronics, Celestron Distributors & Design Houses Identify Design Houses to offer easy turnkey designs (e.g. existing design houses with experience of AATI/Richtek): Cellon & China TechFaith, Longcheer, SIM Training & promotion to Design Houses which have experience with mobile phone makers (especially in China)

  7. Good for LCD screen AX7701/A Highlight - Released size of 2” and below White LED driver (120mA charge pump w/ current source)

  8. AX7701/A Highlight – other description

  9. CMOS Product Roadmap (I) High Freq. CMOS Buck Converter IC AP3516~17 AP3516~17 Sync.3A ~ 5A Sync.3A ~ 5A 1.2MHz buck 1.2MHz buck AX3513-cost down AX3513-cost down Sync. 1A/1.5Mhz Sync. 1A/1.5Mhz Buck converter AX3514-cost down Buck converter AX3514-cost down AX350X Sync. 2A/1.2Mhz AX350X Sync. 2A/1.2Mhz Sync. 0.6A~2.5A Buck converter Sync. 0.6A~2.5A Buck converter 1.5Mhz 1.5Mhz Buck converter Buck converter exist develop Q4’07 Q1’09 Q2 Q3 Q4 2010

  10. CMOS Product Roadmap (II) Boost/Charge Pump IC AX7701 AX7702 AX7703 AX7701 AX7702 AX7703 Charge Pump (1/1.5/2x) Charge Pump (2x) Charge Pump Charge Pump (1/1.5/2x) Charge Pump (2x) Charge Pump LED back-light (4chs) LED back-light (SOT26) Flash light LED back-light (4chs) LED back-light (SOT26) Flash light AX5110-SOT25 AX5510 – DFN3x3 AX5511 – SOT26 AX5110-SOT25 AX5510 – DFN3x3 AX5511 – SOT26 Async. 350mA Async. 3A/1.5Mhz Async. 2A/1.5Mhz Async. 350mA Async. 3A/1.5Mhz Async. 2A/1.5Mhz Boost converter Boost converter Boost converter Boost converter Boost converter Boost converter Low Noise LDO/Reset IC AX6601 ~ AX6609 exist AX6601 ~ AX6609 CMOS LDO + RST develop CMOS LDO + RST 300mA~600mA under plan 300mA~600mA AX6901~6 AX6901~6 RESET IC RESET IC Q1’09 Q2 Q3 Q4 2010 2011

  11. Mobile Handset Market by Stds. Gen. 2004 2009 CAGR Family 2004 2009 CAGR GSM 70% 81% 14.7% 2G 20% 1% -45% 2.5G 76% 49% 2% CDMA 22% 19% 8.9% 3G 4% 51% 90% 1200 TD-SCDMA HSXPA 1000 Handset sell-through (M) 3G EVDO 800 UMTS 1X RTT CDMA2000 600 400 GPRS CDMA 200 GSM / GAIT EDGE iDEN TDMA PDC 0 2002 2001 2003 2004 2005 2006 2007 2008 2009

  12. Trends in Cellular Handset • Low-end handset BOM: Sub-$30 by H1’06, sub-$25 by End’06, sub-$20 by End’07 • Multi-media function in all except the very low-end mobile handsets – FMC – fixed mobile convergent mobile phones with WiFi to support VoIP with UMA / IMS protocols – Video • TVoM was projected at 15% adoption by 2009 or 24Mu in US by 2010 – reception of digital TV through either terrestrial or cellular in-band (HSDPA for UMTS, 1xEV-DO for CDMA2000) – Audio • MP3 audio playback become prevalent, with music download services to reach US$14B by 2011 • Display – LCD screen size by major categories • Smartphone: 2.2” ~ 2.6” • PDA mobile handsets: 2.8” ~ 3.6” • Voice-only mobile handsets: up to 2.2” – TFT-LCD to dominate main display • Low-end will use MSTN or CSTN with/without backlight • OLED (mostly < 1.5”) penetration remain small (< 15% for all display by 2009) while pricing only slightly higher than CSTN-LCD – OLED & CSTN-LCD gradually displace MSTN-LCD for sub display on low-end & mid-range • Form Factors – Clam-shell type flip-phones is projected to be 45% of all handsets by 2009, while it is still slightly lower than the Candy-bar type • Main display likely to use mostly TFT-LCD especially with the proliferation of multimedia support – OLED will take a small share unless video performance much improved • Sub-display mostly < 1.5” and use either MSTN-LCD / OLED – In all handsets, share of slider-type remains small • Improvement in CMOS sensor technology may render “Camera Flash” redundant especially for handsets for the business/enterprise market – Camera Flash may see demand from consumers, or become a checklist/differentiating item – Camera Flash typically consumes around 1W, with light intensity much weaker than those in DSC – In CY05, Strategy Analytics projected camera flash revenues = 36% of total LED market in handsets

  13. Visual & Audio Components TRI 4’06

  14. Market Intelligence of BLU • BLU (backlight unit) vendors – Taiwan • Major BLU vendors: Coretronic, Radiant, Forhouse – Coretronic (major customers: AOU, Chi Mei, Samsung) for 49Mu of DTV and bright-view NB_PC • ChiMei plans to be self-sufficient with 70% of BLU needs • Harvatek for 7” panels – 21 WLEDs for 7” panels, two bars of 20 WLEDs each in 17” LCD monitor • LED manufacturers – Taiwan • Epistar owns 800 LED patents, world largest AlGaInP LED supplier, among top-4 GaN LED supplier • Others are Arima Opto, South Epitaxy – Nichia from Japan, Osram from Germany, Lumileds from Netherlands • 17Mu shipped by top 5 WW notebook panel makers in Q2’06 WW TV Unit Shipment in Q2’06, iSupply WW LCD TV Unit Shipment in Q2’06, iSupply

  15. Major Players in Taiwan market • Top mobile handset OEM: BenQ (Siemens) • Top 4 mobile handset CMs: Compal, Arima, FIH (CMSC), Quanta ( ) FIH • Top ODM of smartphones: HTC • Key partnerships – EMP (Ericsson Mobile Platform) 3G: Compal, Arima, Inventec – Qualcomm: BenQ, Austek, HTC, Inventec • Major EMS/CMs for mobile handsets – Foxconn (FIH) clients: Nokia, Motorola, Sony Ericsson, BenQ • Acquired biggest DSC ODM (Premier Image Tech) in H2’06 – Flextronics clients: Kyocera, Motorola • Relationship with Compal and Kodak, acquired CMOS sensor from ASE • Major application & baseband processor vendors – Mediatek (60Mu in ’06), Realtek, Via

  16. Key Handset ODMs in Taiwan

  17. Key Handset ODMs in Korea

  18. Key Handset ODMs in China

  19. Major Players in China market • Major China-based mobile handsets CM/ODM: Huawei (Vodafone, Motorola), ZTE, TCL-Alcatel • Data access technolgies in decreasing order of dominance: xDSL (71% market share), FTTB+Ethernet (21% market share), cable modem, WLAN – To emerge: WiMAX (802.16a / e), coaxial cable last mile • Major mobile wireless operators: China Mobile, China Unicom – PHS mobile handset vendors in declining market: China Telecom – Key PHS chipset vendors: Atheros – Major handset OEMs: Lenovo, Bird, Amoi, Telsda, Guohong, Skyworth, UTStarcom • Dominant fixed-line local telecom operators & broadband access service operators (87% market share): China Telecom, China Netcom • Independent Design Houses (IDHs) – SIM Technology Group, Longcheer, TechFaith Wireless Comm, Cellon • Major wireless IC fabless semiconductor vendors – Spreadtrum Comm, JadeTech, C2Micro

  20. Major Players in Europe market • Nokia • Sony Ericsson • Siemens (BenQ) - discontinued – Currently focus on business segment – Manufacturing capacities in shift to China • Sagem • Philips • Elcoteq – Largest EMS partner of Nokia due mostly to its root in Finland

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